Monolithic 3D Chips
for the AI Era

FS2 pioneers three-dimensional memory & logic solutions for low energy-consumption, cost, and latency.

Explore Technology

Absolute

Cost Efficiency Maximized

Maximize

Energy Saving Potential

Low-Temp

Process

Wafer Scale

Industrial compatible

About FS2

The Post-Silicon Era Starts Here

The faster compute, more energy dilemma. AI needs efficiency—global data center power consumption will reach 945 TWh by 2030. Silicon alone cannot keep up beyond 2030.

FS2 develops a solution for stacked 3D chip by monolithic 3D integration—compatible with legacy IC infrastructure.

Single Crystal 2D on Any Surface

Wafer-Scale Process

Plug-and-Play with Si Fabs

Multi-Tier M3D Integration

M3D Chip Architecture

2D Material Layer

Wafer-scale 2D Materials growth

Monolithic Integration

3D sequential integration technology

Low-Temp Process

Thermal budget management for BEOL

The Problem

AI Is Hitting a Wall.
We're Breaking Through It.

As AI models grow exponentially, the gap between compute speed and memory bandwidth widens every year. This is the Memory Wall — and it's becoming the defining bottleneck of the AI era.

The Bottleneck

AI models are scaling 240× every two years.
Memory bandwidth is not keeping up.

FS2's Answer

Stack memory directly on logic.
Eliminate the gap entirely.

FS2 is building the technology to break the Memory Wall — enabling the next generation of AI chips that are faster, denser, and radically more efficient.

Technology

World's First Single-Crystal 2D on Amorphous Films

Breaking the thermal barrier with low-temperature growth ready for monolithic integration.

2D Material Layer

Wafer-scale 2D Materials growth

Monolithic Integration

3D sequential integration technology

Low-Temp Process

Thermal budget management for BEOL

FS2 Tech Solution · 2D Direct Growth & Monolithic 3D (M3D)

FS2 Tech Solution: Direct Array on Si wafer → Single Crystal Array → Multi-Tier M3D

Exceptional

Thermal Stability & Reliability

Maximum

Energy Efficiency for AI Workloads

Superior

Carrier Mobility & Transconductance

Team

The Right Team for the Hardest Problems

World-class experts in 2D materials, semiconductor physics, and deep-tech commercialization.

Leadership

Jekyung Kim

Co-CEO & Co-Founder

KAIST Ph.D. · 10+ yrs in Semiconductor

Leadership

Sang-Hoon Bae

Co-CEO & Co-Founder

UCLA Ph.D. · 10+ yrs in Semiconductor

Operations

Intak Jeon

COO

MIT Ph.D. · 7+ yrs in Semiconductor

Advisory Board

Sungkyu Lim

Advisor

Professor, USC · 3D Integration Expert

Advisory Board

Jeehwan Kim

Advisor

Associate Professor, MIT · Device Expert

Advisory Board

Kyusang Lee

Advisor

Associate Professor, UVA · Circuit Expert

Monolithic 3D Chipsfor the AI Era

The Post-Silicon Era Starts Here

2D Material Layer

Monolithic Integration

Low-Temp Process

AI Is Hitting a Wall.We're Breaking Through It.

AI models are scaling 240× every two years.Memory bandwidth is not keeping up.

Stack memory directly on logic.Eliminate the gap entirely.

World's First Single-Crystal 2D on Amorphous Films

2D Material Layer

Monolithic Integration

Low-Temp Process

The Right Team for the Hardest Problems

Jekyung Kim

Sang-Hoon Bae

Intak Jeon

Sungkyu Lim

Jeehwan Kim

Kyusang Lee

Build the Future with Us

Monolithic 3D Chips
for the AI Era

AI Is Hitting a Wall.
We're Breaking Through It.

AI models are scaling 240× every two years.
Memory bandwidth is not keeping up.

Stack memory directly on logic.
Eliminate the gap entirely.